Chiplet Uptake Creates Demand for Best Practices

Chiplets are a great example of a solution that’s been around for a while but is quickly finding more problems to solve. With Moore’s Law now 55 years old and pace of semiconductor manufacturing advancement decelerating, chiplets offer an approach to semiconductor design and integration that hold the promise of speeding up things up again. Recent research released by Omdia forecasts the global market for processor microchips that use chiplets in their manufacturing process to hit $5.8 billion in 2024, a significant jump from $645 million in 2018.

Tom Hackenberg, Omdia’s principal analyst for embedded processors, said chiplets will enable the semiconductor business to return to the customary rate of progress initial set my Moore’s Law by effectively bypassing it. Chiplets replace a single silicon die with multiple smaller dies that work together in a unified packaged solution, which provides much more silicon to add transistors compared to a monolithic microchip. He said this would enable a return to the two-year doubling cycle that has been the economic foundation of the semiconductor business since 1965.

As revolutionary as their promise appears, chiplets are not a new concept, said Hackenberg. “The whole process of shrinking solutions has been around for a long time.” Over time, progress has been made at the system to the board level and then down to the chip level. “Now we’re talking about a next generation iteration where functionality is being designed in at a sub-chip level where, or what we would call a chiplet.

Impact of TIM Dielectric Constant on EMI Radiation

Common EMI sources in many systems are integrated circuits (ICs). ICs are also generators of thermal energy which must be efficiently removed via a heat sink. To enable efficient thermal energy flow a Thermal Interface Material (TIM) is used between the IC and a heat sink. Desirable qualities in a TIM are high thermal conductivity and softness to ensure good physical contact between the IC, heatsink and TIM. However it has been found that the electromagnetic properties of the TIM material can increase the EMI radiation leading to failure in regulatory compliance or deterioration in operating efficiency in the device. This has led many users to demand TIM material with a low dielectric constant (dk). Read this white paper to understand why the TIM dk could have an impact on EMI radiation.  

Impact of TIM Dielectric Constant on EMI Radiation

Common EMI sources in many systems are integrated circuits (ICs). ICs are also generators of thermal energy which must be effi-ciently removed via a heat sink. To enable efficient thermal energy flow a Thermal Interface Material (TIM) is used between the IC and a heat sink. Desirable qualities in a TIM are high thermal conductivity and softness to ensure good physical contact between the IC, heatsink and TIM. However it has been found that the electromagnetic properties of the TIM material can increase theEMI radiation leading to failure in regulatory compliance or deterioration in operating efficiency in the device. This has led manyusers to demand TIM material with a low dielectric constant (dk). This paper will investigate why the TIM dk could have an impact on EMI radiation.

Radiation from an IC

Integrated circuits contain multiple current paths that will generate radiated electromagnetic energy. The inner workings of an actual IC are far too complicated to model in terms of EM radiation. Currents are not constant and will differ based on the ICs operating mode. Therefore to model the IC we need to make some simplifying assumptions.

Source types

A term for any object or component that radiates electromagnetic energy is an antenna. Depending on their size, shape, material properties, different antennas will radiate in different ways. Some will radiate very well, some not so well. For our purposes there are only two basic categories of antennas, linear and circular. In a linear antenna, the conductive portion is a straight line similar to the radio antenna on your car. The current is constrained by the ends of the antenna. In a circular antenna, the current isnot con-strained and freely propagates out from the energy source then returns to the energy source. We have found that the best model to represent radiation from an IC is a circular (loop) source mounted vertically on a printed circuit board (PCB). The analysisin this paper regarding the impact of the dielectric constant would be very similar for any type of source. The model shown below represents a vertical loop source realized on a PCB, the current path goes from the source at left up one conductive post then across the horizontal conductive portion then down the second conductive post and returns to the source viathe conductive ground plane. In our model the antenna height is 2mm and the antenna length (horizontal portion) will vary.

Rough waters, extreme heat and broad frequency ranges: Protecting military electronics in challenging conditions

Military electronics must operate reliably in the harshest conditions and across a wide range of frequencies. Read this article by Laird’s Paul Dixon to learn how materials science innovations enable and protect sensitive electronics from evolving threats.  

Military equipment – everything from radomes to fighter jets – and the soldiers who operate this equipment depend on the reliable operation of sensitive electronics. These electronics, in turn, rely on small, passive materials that mitigate stray signal interference, enhance antenna patterns and enable survivability capabilities. These materials absorb or attenuate electromagnetic energy and are called microwave absorbers.

Stray signals can interfere with crucial communications systems and degrade the performance of electronic components. Sidelobes and back scatter can reduce the quality of antenna signals. So, design engineers in the military and aerospace industries desperately need resilient and reliable microwave absorbers to protect crucial electronics and equipment against evolving threats.

Why protecting military electronics is so hard

From frigid winters in Afghanistan to sweltering summers in Iraq, military electronics face the harshest weather conditions on the globe. In addition to having to operate reliably in extreme weather conditions, absorbers often rest near hot engines and may even come into contact with jet or missile fuel. Further, they often undergo violent expansion and contraction. And materials on military ships are of course at risk of corrosion.

But the challenges don’t end with heat, cold, water and harsh substances like jet fuel. Absorbers also must operate effectively across a wider range of frequencies than ever before. Traditionally, military absorbers needed to be effective between 2-18 GHz. Now, as enemy radar capabilities improve, absorbers must operate effectively at frequencies as low as 200 MHz. Absorbers also must enable 5G and weapons communications, which take place at high frequencies, including in the millimeter wave range.

An absorber’s external coating protects it from harsh environmental conditions while its internal filler material has magnetic and dielectric properties that help it prevent return energy and mitigate signal interference.

Fluorosilicone becomes essential

Traditional silicone absorbers can’t stand up to the rigorous conditions in certain military applications, especially near jet engines or weaponry. But fluorosilicone absorbers can. Laird R&F Products recently announced the release of a line of fluorosilicone microwave absorbers, conductive and non-conductive elastomers, and thermal insulators that can withstand extremely high temperatures and exposure to JP8 and JP10 fuels, oils and de-icing fluids. Further, the material can handle intense expansion and contraction without stretching or cracking.

The ruggedness of fluorosilicone allows design engineers to fit absorbers in the optimal locations for signal and survivability enhancement – even if that’s right near an engine. Additionally, creative uses of fluorosilicone absorbers can allow design engineers to accomplish multiple goals at once. For example, when loaded with high-strength microballoons that provide insulation, a design engineer can use a fluorosilicone absorber as a thermal barrier to protect composite materials from hot gasses. Additionally, when comolded with a conductive elastomer, a fluorosilicone absorber can not only absorb stray electromagnetic interference but also operate as a conductive ground plane.

The challenging environmental conditions absorbers face in military applications make fluorosilicone an essential material for design engineers.

Novel filler materials cover broad range of frequencies

Standard magnetic absorbers that work in the 2-18 GHz range are filled with standard magnetic powder. But to hide military vehicles and personnel from radar detection in low frequency ranges, materials scientists at Laird R&F Products are using different alloys and even changing particle morphology from spheres to shaped materials to prevent return energy. To make absorbers effective in the millimeter wave range, Laird R&F materials scientists similarly use novel fillers (in this case, carbon or lossy ceramic fillers).

The current innovation taking place in the material makeup of fillers enhances absorber performance across a broad range of frequencies. Given the crucial role absorbers play in survivability enhancement, it’s hard to overstate the importance of these advancements.

Materials science innovations drive military and aerospace performance gains

 To meet the exacting demands of the Pentagon and defense operations of NATO countries, and ensure the reliable operation of military electronics, military and aerospace design engineers must embrace these materials science innovations. By using novel filler materials and fluorosilicone, design engineers can create tailored absorber solutions that are resilient amid harsh environmental conditions and reliable across a wide range of frequencies. In the end, these advancements on the materials science front contribute greatly to protecting the servicemen and women on the front lines in global hotspots.

Automotive design engineers: Avoid the “oh no” moment

An automotive design engineer is working on a concept for a “smart” windshield. He draws out what appears on paper to be the perfect design, and tests the solution using advanced analysis software. The results look good, and the design engineer builds a prototype. But, when testing the prototype, things don’t run as expected. Signal interference hinders the windshield’s performance, and excessive heat spawned by PCB components threatens to shut the system down completely. This is the “oh no” moment.

In the past decade, automobiles have rapidly evolved. Once comprised largely of mechanical components, cars are now “smart,” and have sensors and complex electronic components all over them. From advanced driver-assistance systems to headlights with PCB boards to bumpers with sensors, nearly every area of a car requires a high level of design engineering innovation. This innovation poses great benefits to drivers – but creates new complexities for engineers.

For one, to enhance performance of the “smart” features, engineers must fit more powerful components into tight spaces on PCBs. These components produce large amounts of heat, forcing engineers to get creative to dissipate this heat within limited real estate. Further, 5G is pushing frequencies into the millimeter wave range, making the solutions engineers once used to mitigate electromagnetic interference at lower frequencies obsolete. And the solutions engineers develop must be easily replicable to keep manufacturing costs under control. These issues that accompany the rapid pace of innovation in the automotive industry make the “oh no” moment more common. Here are some ways design engineers can overcome these unprecedented challenges:

1.     Prioritize system-level design

Today, electromagnetic interference and heat issues are more intertwined than ever before. A heat sink can create signal issues, for example. So, the solution the thermal team adds to a board can create problems for an EMI-focused engineer, and vice versa. When design engineers work in silos, the final prototype can have unexpected signal, heat or structural issues – and, in the worst cases, exceed limits during testing. A system-level approach that brings these teams together early in the design process allows design engineers to work together and solve problems holistically, incorporating solutions that solve multiple issues and freeing up space on the board.

2.     Lean on your resources

Design engineers can sometimes be hesitant to involve third parties until they are absolutely needed to solve a problem. However, third-party vendors are more than salespeople. They often have experience and knowledge that can help design engineers pre-empt structural, signal or heat problems and, in the end, bring a product to market more quickly. Soliciting these individuals’ input early in the design process can potentially prevent months of tests and failures – and lead to a successful solution earlier.

3.     Embrace automation

A groundbreaking solution that is costly and difficult to manufacture repeatedly will be difficult to sell to an automotive manufacturer. So, design engineers must marry innovation with replicability. One way to do this is to embrace automation wherever possible. At Laird Performance Materials, we’ve spearheaded the automated application of thermal interface materials, which helps design teams easily apply all types of thermal interface materials – from dispensable TIMs to phase-change materials to gap filler pads – efficiently, improve yields and control costs. Design engineers should look for opportunities to inject automated processes into their designs to ensure their solutions end up on vehicles.

Designers of automotive electronics play a crucial role in propelling innovation forward in the industry. As cars continue to become “smarter,” and require more powerful components in smaller spaces on boards, design engineers will face increasingly complex challenges. Those engineers that think holistically, use all the resources available to them and prioritize the manufacturability of their design will be best prepared to avoid the “oh no” moments.

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